I would imagine this is of decent interest to people reverse engineering chip designs, or doing failure analysis, so it’s possible someone might actually be trying this at scale.
You can destructively deprocess dies, removing a layer at a time and imaging at each layer. 20ish years ago you could still do this with a polishing wheel and a fine slurry; don’t know if that’s still viable.
[–] amelius 11 hours ago
[–] josh-wrale 11 hours ago
[–] dgfl 10 hours ago
I would imagine this is of decent interest to people reverse engineering chip designs, or doing failure analysis, so it’s possible someone might actually be trying this at scale.
[–] Arubis 7 hours ago
[–] throwaway198846 11 hours ago
[–] kkotak 10 hours ago
[–] elictronic 10 hours ago
Garbage in, it’ Herpes.
[–] giancarlostoro 10 hours ago