Not sure if regular tomography would work, but this has been done at high enough resolution with some fancier techniques (ptychography): https://www.nature.com/articles/s41586-024-07615-6

I would imagine this is of decent interest to people reverse engineering chip designs, or doing failure analysis, so it’s possible someone might actually be trying this at scale.

You can destructively deprocess dies, removing a layer at a time and imaging at each layer. 20ish years ago you could still do this with a polishing wheel and a fine slurry; don’t know if that’s still viable.